Patent Assignment
Reel/Frame 033063/0106
Assignment of Assignor's Interest
Recorded: 2014-06-10
Pages: 9
Assignors
PARK, HEE JUN
Executed: 2014-05-21
KANG, YOUNG HOON
Executed: 2014-05-21
ALTON, RONALD FRANK
Executed: 2014-05-21
MEDRANO, CHRISTOPHER LEE
Executed: 2014-06-03
ANDERSON, JON JAMES
Executed: 2014-06-03
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121
Covered Properties
(3)
Energy Efficiency Aware Thermal Management in a Multi-Processor System on a Chip
System and Method for Thermal Mitigation in a System on a Chip
Application:
61/977,013 →
Energy Efficiency Aware Thermal Management in a Heterogeneous Multi-Processor System on a Chip
Application:
61/981,714 →
Related Assignments
(2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 10, 2014
From: PARK, HEE JUN; KANG, YOUNG HOON; ALTON, RONALD FRANK; MEDRANO, CHRISTOPHER LEE
To: QUALCOMM INCORPORATED
Reel/Frame 033062/0780 →
Assignment of Assignor's Interest
Jun 10, 2014
From: PARK, HEE JUN; KANG, YOUNG HOON; ALTON, RONALD FRANK; MEDRANO, CHRISTOPHER LEE
To: QUALCOMM INCORPORATED
Reel/Frame 033063/0023 →