Patent Assignment
Reel/Frame 033104/0781
Assignment of Assignor's Interest
Recorded: 2014-06-15
Pages: 4
Assignors
HSU, TZU-HSUAN
Executed: 2014-04-30
HSIEH, YUAN-CHIH
Executed: 2014-04-30
YAUNG, DUN-NIAN
Executed: 2014-04-30
YU, CHUNG-YI
Executed: 2014-04-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method of Making Wafer Structure for Backside Illuminated Color Image Sensor