Patent Assignment
Reel/Frame 033162/0706
Assignment of Assignor's Interest
Recorded: 2014-06-24
Pages: 3
Assignors
WU, JIUN-PENG
Executed: 2014-06-09
OHTOU, TETSU
Executed: 2014-06-09
TSAI, CHING-WEI
Executed: 2014-06-09
WANG, CHIH-HAO
Executed: 2014-06-09
LIU, CHI-WEN
Executed: 2014-06-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN ROAD, VI, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Device Including a Semiconductor Sheet Unit Interconnecting a Source and a Drain