Patent Assignment
Reel/Frame 033166/0591
Assignment of Assignor's Interest
Recorded: 2014-06-24
Pages: 3
Assignors
LIN, YU-HUNG
Executed: 2014-06-17
LIN, SHENG-HSUAN
Executed: 2014-06-17
CHANG, CHIH-WEI
Executed: 2014-06-17
CHOU, YOU-HUA
Executed: 2014-06-17
HSU, CHIA-LIN
Executed: 2014-06-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6 SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Composite Contact Plug Structure and Method of Making Same