Patent Assignment
Reel/Frame 033174/0021
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2014-06-25
Received: 2014-06-25
Pages: 29
Assignors
ST WIRELESS SA
Executed: 2008-07-14
NXP B.V.
Executed: 2008-07-28
ST-ERICSSON AT SA
Executed: 2009-02-12
ST-ERICSSON SA
Executed: 2013-08-02
Assignee
ERICSSON MODEMS SA
CHEMIN DU CHAMP-DES-FILLES 39, PLAN-LES-OUATES, CHX, 1228, SWITZERLAND
Covered Application
(1)
FILL STRUCTURES FOR USE WITH A SEMICONDUCTOR INTEGRATED CIRCUIT INDUCTOR
App. No. 11/014,142
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