IP Library › Assignment 033174/0472
Patent Assignment
Reel/Frame 033174/0472

Assignment of Assignor's Interest

Recorded: 2014-06-25 Pages: 11
Assignor
Assignee
ASM LASER SEPARATION INTERNATIONAL (ALSI) B.V.
PRINS BERNARDPLEIN 200, AMSTERDAM, 1097 JB, NETHERLANDS
Covered Property (1)
Method of Radiatively Grooving a Semiconductor Substrate
Patent: 9,120,178 →
Application: 14/165,029 →
Publication: US 2014/0213043
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 18, 2014
From: VAN DER STAM, KAREL MAYKEL RICHARD
To: ADVANCED LASER SEPARATION INTERNATIONAL (ALSI) N.V.
Reel/Frame 033133/0181 →
Assignment of Assignor's Interest Jun 25, 2014
From: ASM LASER SEPARATION INTERNATIONAL (ALSI) B.V.
To: ASM TECHNOLOGY SINGAPORE PTE. LTD.
Reel/Frame 033174/0518 →
Change of Name Nov 21, 2022
From: ASM TECHNOLOGY SINGAPORE PTE LTD
To: ASMPT SINGAPORE PTE. LTD.
Reel/Frame 061975/0605 →