Patent Assignment
Reel/Frame 033178/0411
Assignment of Assignor's Interest
Recorded: 2014-06-25
Pages: 2
Assignors
LIANG, YU-MIN
Executed: 2014-06-16
LII, MIRNG-JI
Executed: 2014-06-16
WU, JIUN YI
Executed: 2014-06-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6 SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Substrate Design for Semiconductor Packages and Method of Forming Same