Patent Assignment
Reel/Frame 033184/0245
Assignment of Assignor's Interest
Recorded: 2014-06-26
Pages: 3
Assignors
PARK, BAEK SOUNG
Executed: 2014-02-25
CHOI, JAE WON
Executed: 2014-02-25
KIM, SUNG MIN
Executed: 2014-02-25
KIM, IN HWAN
Executed: 2014-02-25
LEE, JUN WOO
Executed: 2014-02-24
IM, SU MI
Executed: 2014-02-26
Assignee
CHEIL INDUSTRIES, INC.
290 GONGDAN-DONG, GUMI-SI, KYEONGSANGBUK-DO, 730-030, KOREA, REPUBLIC OF
Covered Property
(1)
Dicing Die-Bonding Film and Method of Forming a Cut on the Dicing Die-Bonding Film