Patent Assignment
Reel/Frame 033193/0423
Assignment of Assignor's Interest
Recorded: 2014-06-27
Pages: 9
Assignors
HUANG, JIAN-SHIOU
Executed: 2014-06-18
CHANG, YAO-WEN
Executed: 2014-06-18
LIN, HSING-LIEN
Executed: 2014-06-18
TSAI, CHENG-YUAN
Executed: 2014-06-18
TSAI, CHIA-SHIUNG
Executed: 2014-06-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
MIM/RRAM Structure with Improved Capacitance and Reduced Leakage Current