Patent Assignment
Reel/Frame 033224/0990
Assignment of Assignor's Interest
Recorded: 2014-07-01
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2014-06-23
JENG, SHIN-PUU
Executed: 2014-06-23
YEH, DER-CHYANG
Executed: 2014-06-23
CHEN, HSIEN-WEI
Executed: 2014-06-23
HSIEH, CHENG-CHIEH
Executed: 2014-06-23
CHIU, MING-YEN
Executed: 2014-06-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Semiconductor Package for Thermal Dissipation