Patent Assignment
Reel/Frame 033256/0609
Assignment of Assignor's Interest
Recorded: 2014-07-08
Pages: 4
Assignor
KIM, YOUNG-BAE
Executed: 2014-06-24
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Having Through-Substrate via Plugs and Semiconductor Packages Including the Same