Patent Assignment
Reel/Frame 033259/0945
Assignment of Assignor's Interest
Recorded: 2014-07-08
Pages: 3
Assignee
MURATA MANUFACTURING CO., LTD.
10-1 HIGASHIKOTARI 1-CHOME, NAGAOKAKYO-SHI, KYOTO-FU, 617-8555, JAPAN
Covered Property
(1)
Electronic Component Thickness Measurement Method, Method for Manufacturing a Series of Electronic Components Using the Measurement Method, a Series of Electronic Components Manufactured by the Manufacturing Method, and Electronic Component Inspection Apparatus