Patent Assignment
Reel/Frame 033275/0102
Assignment of Assignor's Interest
Recorded: 2014-07-09
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6 SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Fan-Out Stacked System in Package (SIP) and the Methods of Making the Same