Patent Assignment
Reel/Frame 033286/0296
Assignment of Assignor's Interest
Recorded: 2014-07-10
Pages: 2
Assignors
SHIMIZU, NORIYOSHI
Executed: 2014-05-12
KOYAMA, TOSHINORI
Executed: 2014-05-12
ROKUGAWA, AKIO
Executed: 2014-05-12
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO-KEN, 381-2287, JAPAN
Covered Property
(1)
Wiring Board, Semiconductor Device, and Method of Manufacturing Wiring Board