Patent Assignment
Reel/Frame 033329/0015
Assignment of Assignor's Interest
Recorded: 2014-07-17
Pages: 7
Assignors
JUNG, DEOK-YOUNG
Executed: 2014-07-16
KANG, PIL-KYU
Executed: 2014-07-16
PARK, BYUNG-LYUL
Executed: 2014-07-16
PARK, JI-SOON
Executed: 2014-07-16
SON, SEONG-MIN
Executed: 2014-07-16
AN, JIN-HO
Executed: 2014-07-16
KIM, JI-HWANG
Executed: 2014-07-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages, Methods of Manufacturing the Same, and Semiconductor Package Structures Including the Same