IP Library › Assignment 033335/0907
Patent Assignment
Reel/Frame 033335/0907

Assignment of Assignor's Interest

Recorded: 2014-07-17 Pages: 5
Assignors
YOSHIZAWA, KAZUTAKA
Executed: 2014-07-06
EMA, TAIJI
Executed: 2013-12-18
Assignee
FUJITSU SEMICONDUCTOR LIMITED
2-10-23 SHIN-YOKOHAMA, KOHOKU-KU YOKOHAMA-SHI, KANAGAWA, 222-0033, JAPAN
Covered Property (1)
Semiconductor Wafer and Its Manufacture Method, and Semiconductor Chip
Patent: 9,685,416 →
Application: 14/269,840 →
Publication: US 2014/0239456
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 6, 2014
From: YOSHIZAWA, KAZUTAKA; EMA, TAIJI
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 032831/0853 →
Change of Address Dec 23, 2016
From: FUJITSU SEMICONDUCTOR LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 041188/0401 →
Assignment of Assignor's Interest Jul 13, 2020
From: FUJITSU SEMICONDUCTOR LIMITED
To: FUJITSU SEMICONDUCTOR MEMORY SOLUTION LIMITED
Reel/Frame 053195/0249 →