Patent Assignment
Reel/Frame 033337/0556
Assignment of Assignor's Interest
Recorded: 2014-07-17
Pages: 4
Assignors
LIU, YU-CHIH
Executed: 2014-07-16
CHANG, CHIEN-KUO
Executed: 2014-07-16
LIN, WEI-TING
Executed: 2014-07-16
HO, KUAN-LIN
Executed: 2014-07-16
CHEN, CHIN-LIANG
Executed: 2014-07-16
LIN, SHIH-YEN
Executed: 2014-07-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Packaging Methods for Semiconductor Devices with Encapsulant Ring