Patent Assignment
Reel/Frame 033344/0347
Assignment of Assignor's Interest
Recorded: 2014-07-18
Pages: 4
Assignor
MEYER, THORSTEN
Executed: 2014-07-18
Assignee
INTEL IP CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
High Density Chip-to-Chip Connection
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.