Patent Assignment
Reel/Frame 033375/0930
Assignment of Assignor's Interest
Recorded: 2014-07-23
Pages: 2
Assignor
HIRAYAMA, MASAHIRO
Executed: 2014-07-14
Assignee
SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
1, KANAI-CHO, SAKAE-KU, YOKOHAMA-SHI, KANAGAWA, 244-0845, JAPAN
Covered Property
(1)
A Flexible Substrate Having a Microstrip Line Connected to a Connection Portion with a Specified Conductor Pattern