Patent Assignment
Reel/Frame 033381/0119
Assignment of Assignor's Interest
Recorded: 2014-07-24
Pages: 3
Assignee
EV GROUP E. THALLNER GMBH
1, DI ERICH THALLNER STRASSE, ST. FLORIAN AM INN, A-4782, AUSTRIA
Covered Property
(1)
Pressure Transmitting Device for Bonding Chips Onto a Substrate