Patent Assignment
Reel/Frame 033400/0625
Assignment of Assignor's Interest
Recorded: 2014-07-28
Pages: 2
Assignor
LIN, YAOJIAN
Executed: 2014-07-28
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Method of Fabricating Double Sided RDL FOWLP with Embedded Temporary Si Die RDL
Application:
62/021,135 →