Patent Assignment
Reel/Frame 033404/0387
Assignment of Assignor's Interest
Recorded: 2014-07-28
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2014-07-16
CHEN, MING-FA
Executed: 2014-07-16
TSAI, WEN-CHING
Executed: 2014-07-16
YEH, SUNG-FENG
Executed: 2014-07-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
3D Chip-on-Wafer-on-Substrate Structure with via Last Process