Patent Assignment
Reel/Frame 033420/0642
Assignment of Assignor's Interest
Recorded: 2014-07-30
Pages: 4
Assignors
HUANG, CHIH-FAN
Executed: 2014-07-22
WU, CHENG-TAR
Executed: 2014-07-22
CHENG, MING-DA
Executed: 2014-07-22
LIU, CHUNG-SHI
Executed: 2014-07-22
YU, CHEN-HUA
Executed: 2014-07-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Packages with Molding Structures and Methods of Forming the Same