Patent Assignment
Reel/Frame 033437/0624
Assignment of Assignor's Interest
Recorded: 2014-07-31
Pages: 5
Assignors
CHERN, CHYI SHYUAN
Executed: 2014-05-12
WU, HSIN-HSIEN
Executed: 2014-06-10
YU, CHIH-KUANG
Executed: 2014-05-13
KUO, HUNG-YI
Executed: 2014-05-21
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Method and Apparatus for Accurate Die-to-Wafer Bonding
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Nov 25, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037160/0220 →
Merger
Nov 25, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037160/0234 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →