Patent Assignment
Reel/Frame 033438/0961
Assignment of Assignor's Interest
Recorded: 2014-07-31
Pages: 4
Assignor
KIM, SANG-UK
Executed: 2014-05-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Devices Including Interposer Openings for Heat Transfer Member