Patent Assignment
Reel/Frame 033445/0586
Assignment of Assignor's Interest
Recorded: 2014-08-01
Pages: 3
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Systems and Methods Providing Thermal Spreading for an LED Module
Application:
14/286,534 →
Publication:
US 2014/0254180
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.