Patent Assignment
Reel/Frame 033464/0961
Assignment of Assignor's Interest
Recorded: 2014-08-05
Pages: 4
Assignor
KIM, KIL-SOO
Executed: 2014-07-07
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Multi-Chip Package Having a Logic Chip Disposed in a Package Substrate Opening and Connecting to an Interposer