IP Library Assignment 033477/0789
Patent Assignment
Reel/Frame 033477/0789

Assignment of Assignor's Interest

Recorded: 2014-08-06 Pages: 4
Assignor
ITO, TETSUMASA
Executed: 2014-07-25
Assignee
SAKURA FINETEK JAPAN CO., LTD.
1-9, NIHONBASHI-HONCHO 3-CHOME, CHUO-KU, TOKYO, 103-0023, JAPAN
Covered Property (1)
Thin Section Fabrication Apparatus and Method of Fabricating Thin Section
Patent: 9,164,014 →
Application: 14/376,552 →
Publication: US 2015/0017679