Patent Assignment
Reel/Frame 033482/0229
Assignment of Assignor's Interest
Recorded: 2014-08-07
Pages: 14
Assignors
KASKOUN, KENNETH
Executed: 2014-07-10
ZHANG, RONGTIAN
Executed: 2014-07-12
NOWAK, MATTHEW MICHAEL
Executed: 2014-07-30
GU, SHIQUN
Executed: 2014-07-29
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property
(1)
Integrated Circuit Module with Lead Frame Micro-Needles
Patent:
9,138,191 →
Application:
14/326,842 →
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Feb 11, 2019
From: CAPSULE TECHNOLOGIES, INC.; CAPSULETECH, INC.
To: TC LENDING, LLC
Reel/Frame 048301/0269 →
Patent Assignment Effective as of 02/11/2019
Feb 11, 2019
From: QUALCOMM INCORPORATED
To: QUALCOMM LIFE, INC.
Reel/Frame 048301/0902 →
Change of Name
Feb 15, 2019
From: QUALCOMM LIFE, INC.
To: CAPSULE TECHNOLOGIES, INC.
Reel/Frame 048356/0787 →
Release of the Security Interest Recorded at Reel/Frame 048301/0269
Apr 17, 2020
From: TC LENDING, LLC, AS COLLATERAL AGENT
To: CAPSULE TECHNOLOGIES, INC.
Reel/Frame 052434/0262 →
Assignment of Assignor's Interest
Apr 28, 2020
From: CAPSULE TECHNOLOGIES, INC.
To: PHILIPS HEALTHCARE INFORMATICS, INC.
Reel/Frame 053262/0405 →
Release of Security Interest
Mar 4, 2021
From: TC LENDING, LLC
To: CAPSULETECH, INC.; CAPSULE TECHNOLOGIES, INC.
Reel/Frame 056455/0263 →