Patent Assignment
Reel/Frame 033486/0750
Assignment of Assignor's Interest
Recorded: 2014-08-07
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6 SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Protrusion Bump Pads for Bond-on-Trace Processing