Patent Assignment
Reel/Frame 033493/0261
Assignment of Assignor's Interest
Recorded: 2014-08-08
Pages: 7
Assignors
KASAI, WATARU
Executed: 2014-07-16
HIGUCHI, YOSHIAKI
Executed: 2014-07-16
ATAKU, MASAKAZU
Executed: 2014-07-16
TAGUCHI, DAISUKE
Executed: 2014-07-16
OTSUGU, SATOSHI
Executed: 2014-07-16
Assignee
ASAHI GLASS COMPANY, LIMITED
5-1, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-8405, JAPAN
Covered Property
(1)
Mold Release Film and Method of Process for Producing a Semiconductor Device Using the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.