Patent Assignment
Reel/Frame 033509/0347
Assignment of Assignor's Interest
Recorded: 2014-08-11
Pages: 4
Assignors
CHEN, CHEN-SHIEN
Executed: 2014-07-30
CHEN, YU-FENG
Executed: 2014-08-05
LIN, YU-WEI
Executed: 2014-07-30
KUO, TIN-HAO
Executed: 2014-07-30
LIANG, YU-MIN
Executed: 2014-08-04
LIN, CHUN-HUNG
Executed: 2014-07-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO. 8, LI-HSIN RD., 6 SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Protrusion Bump Pads for Bond-on-Trace Processing