Patent Assignment
Reel/Frame 033565/0290
Assignment of Assignor's Interest
Recorded: 2014-08-19
Pages: 5
Assignee
KLA-TENCOR CORPORATION
ONE TECHNOLOGY DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Method and System for High Speed Height Control of a Substrate Surface Within a Wafer Inspection System