Patent Assignment
Reel/Frame 033586/0633
Assignment of Assignor's Interest
Recorded: 2014-08-21
Pages: 8
Assignors
KANG, PIL-KYU
Executed: 2014-07-21
PARK, BYUNG LYUL
Executed: 2014-07-21
KANG, SUNGHEE
Executed: 2014-07-21
KIM, TAESEONG
Executed: 2014-07-21
KIM, TAEYEONG
Executed: 2014-07-21
MOON, KWANGJIN
Executed: 2014-07-22
PARK, JAE-HWA
Executed: 2014-07-21
BANG, SUKCHUL
Executed: 2014-07-21
SON, SEONGMIN
Executed: 2014-07-21
AN, JIN HO
Executed: 2014-07-21
LEE, HO-JIN
Executed: 2014-07-21
JIN, JEONGGI
Executed: 2014-07-21
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Having Through-Electrodes and Methods for Fabricating the Same