Patent Assignment
Reel/Frame 033595/0282
Assignment of Assignor's Interest
Recorded: 2014-08-22
Pages: 4
Assignors
WU, JIUN YI
Executed: 2014-08-14
LIANG, YU-MIN
Executed: 2014-08-14
LII, MIRNG-JI
Executed: 2014-08-14
LEE, CHIEN-HSUN
Executed: 2014-08-14
WANG, TSUNG-DING
Executed: 2014-08-19
CHENG, JUNG WEI
Executed: 2014-08-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Package-On-Package Structure with Organic Interposer