IP Library › Assignment 033598/0252
Patent Assignment
Reel/Frame 033598/0252

Assignment of Assignor's Interest

Recorded: 2014-08-25 Pages: 2
Assignors
HIGUMA, MASATO
Executed: 2014-07-07
SAGAWA, TOSHIFUMI
Executed: 2014-07-08
SHIMURA, TAKAHIRO
Executed: 2014-07-14
YOSHINARI, HIDETO
Executed: 2014-07-15
Assignee
HITACHI AUTOMOTIVE SYSTEMS, LTD.
2520, TAKABA, HITACHINAKA-SHI, IBARAKI, JAPAN
Covered Property (1)
Power Semiconductor Module
Patent: 9,474,191 →
Application: 14/379,957 →
Publication: US 2015/0016063
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 25, 2021
From: HITACHI AUTOMOTIVE SYSTEMS, LTD.
To: HITACHI ASTEMO, LTD.
Reel/Frame 056299/0447 →