Patent Assignment
Reel/Frame 033603/0030
Assignment of Assignor's Interest
Recorded: 2014-08-25
Pages: 2
Assignor
MICRO MACHINES, INC.
Executed: 1995-02-16
Assignee
KAVLICO CORPORATION
14401 PRINCETON AVENUE, MOORPARK, CALIFORNIA, 93021
Covered Property
(1)
Process for Making a Semiconductor Sensor with a Fusion Bonded Flexible Structure
Patent:
5,576,251 →
Application:
08/395,397 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Oct 3, 2014
From: BEI SENSORS & SYSTEMS COMPANY, INC.; CUSTOM SENSORS & TECHNOLOGIES, INC; CRYDOM, INC.; BEI TECHNOLOGIES, INC.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 033888/0700 →
Release of Security Interest
Dec 2, 2015
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: BEI SENSORS & SYSTEMS COMPANY, INC.; CUSTOM SENSORS & TECHNOLOGIES, INC.; CRYDOM, INC.; BEI TECHNOLOGIES, INC.
Reel/Frame 037196/0174 →