IP Library Assignment 033634/0807
Patent Assignment
Reel/Frame 033634/0807

Assignment of Assignor's Interest

Recorded: 2014-08-28 Pages: 4
Assignors
EDELEN, JOHN GLENN
Executed: 2014-08-26
SEMLER, NICOLE
Executed: 2014-08-27
MARRA, MICHAEL
Executed: 2014-08-27
Assignee
FUNAI ELECTRIC CO., LTD
7-7-1, NAKAGAITO, DAITO-SHI, OSAKA, 5740013, JAPAN
Covered Property (1)
Chip Layout to Enable Multiple Heater Chip Vertical Resolutions
Patent: 9,434,165 →
Application: 14/472,297 →
Publication: US 2016/0059560
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 3, 2025
From: FUNAI ELECTRIC CO., LTD.
To: BRADY WORLDWIDE, INC.
Reel/Frame 070724/0277 →