Patent Assignment
Reel/Frame 033665/0148
Assignment of Assignor's Interest
Recorded: 2014-08-29
Pages: 8
Assignors
AO, ERIC R.
Executed: 2014-08-27
FLINT, STEPHEN J.
Executed: 2014-08-27
HOGAN, MICHAEL W.J.
Executed: 2014-08-27
MCGALE, SHANNON D.
Executed: 2014-08-27
SALINAS, RODOLFO B.
Executed: 2014-08-27
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Maximizing Surface Area of Surface Mount Contact Pads of Circuit Board Also Having via Contact Pads
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 10, 2014
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
Reel/Frame 034194/0111 →
Assignment of Assignor's Interest
Sep 6, 2019
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE LTD.
To: LENOVO INTERNATIONAL LIMITED
Reel/Frame 050298/0505 →