Patent Assignment
Reel/Frame 033677/0115
Assignment of Assignor's Interest
Recorded: 2014-09-05
Pages: 2
Assignors
SHIMIZU, NORIYOSHI
Executed: 2014-07-07
KANEDA, WATARU
Executed: 2014-07-07
ARISAKA, HIROMU
Executed: 2014-07-07
ROKUGAWA, AKIO
Executed: 2014-07-07
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO-KEN, 381-2287, JAPAN
Covered Property
(1)
Wiring Board, Semiconductor Device, and Method of Manufacturing Wiring Board