IP Library › Assignment 033724/0579
Patent Assignment
Reel/Frame 033724/0579

Assignment of Assignor's Interest

Recorded: 2014-09-11 Pages: 4
Assignors
TSAI, SHU-TING
Executed: 2014-09-01
CHEN, SZU-YING
Executed: 2014-09-09
LIN, JENG-SHYAN
Executed: 2014-09-01
HSU, TZU-HSUAN
Executed: 2014-09-01
HUNG, FENG-CHI
Executed: 2014-09-01
YAUNG, DUN-NIAN
Executed: 2014-09-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
3DIC Interconnect Devices and Methods of Forming Same
Patent: 9,455,158 →
Application: 14/483,908 →
Publication: US 2015/0348905
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Serial Number Previously Recorded on Reel 033724 Frame 0579. Assignor(S) Hereby Confirms the Assignmnet of Assignors Interest. Sep 18, 2014
From: TSAI, SHU-TING; CHEN, SZU-YING; LIN, JENG-SHYAN; HSU, TZU-HSUAN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
Reel/Frame 033773/0656 →