Patent Assignment
Reel/Frame 033734/0566
Assignment of Assignor's Interest
Recorded: 2014-09-12
Pages: 7
Assignors
SHIM, IL KWON
Executed: 2014-09-02
MARIMUTHU, PANDI C.
Executed: 2014-09-02
CHOI, WON KYOUNG
Executed: 2014-09-02
GOH, SZE PING
Executed: 2014-09-04
CAPARAS, JOSE A.
Executed: 2014-09-02
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Structure and Method of Making Double Side Fan-Out Wafer Level Package
Application:
62/034,354 →