IP Library Assignment 033749/0424
Patent Assignment
Reel/Frame 033749/0424

Assignment of Assignor's Interest

Recorded: 2014-09-16 Pages: 3
Assignor
CRISTALDI, GIUSEPPE
Executed: 2014-04-30
Assignee
STMICROELECTRONICS S.R.L.
VIA C. OLIVETTI 2, AGRATE BRIANZA (MB), 20864, ITALY
Covered Property (1)
Electronic Device with Bimetallic Interface Element for Wire Bonding
Patent: 9,184,150 →
Application: 14/487,559 →
Publication: US 2015/0076712
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 1, 2022
From: STMICROELECTRONICS S.R.L.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 061828/0243 →