IP Library Assignment 033760/0628
Patent Assignment
Reel/Frame 033760/0628

Assignment of Assignor's Interest

Recorded: 2014-09-17 Pages: 2
Assignor
KIM, TAI HO
Executed: 2014-09-15
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Devices Having a Trench Isolation Layer and Methods of Fabricating the Same
Patent: 8,941,210 →
Application: 14/445,291 →
Publication: US 2014/0332921
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Release of Security Interest Apr 26, 2017
From: SILICON VALLEY BANK, AS SUCCESSOR ADMINISTRATIVE AGENT
To: IXIA
Reel/Frame 042335/0465 →