Patent Assignment
Reel/Frame 033771/0651
Assignment of Assignor's Interest
Recorded: 2014-09-18
Pages: 3
Assignors
CHENG, JUNG WEI
Executed: 2014-02-18
WANG, TSUNG-DING
Executed: 2014-02-18
LII, MIRNG-JI
Executed: 2014-02-18
LEE, CHIEN-HSUN
Executed: 2014-02-18
YU, CHEN-HUA
Executed: 2014-09-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6 SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Substrate Design for Semiconductor Packages and Method of Forming Same