IP Library › Assignment 033777/0356
Patent Assignment
Reel/Frame 033777/0356

Assignment of Assignor's Interest

Recorded: 2014-09-19 Pages: 7
Assignors
WATANABE, KENICHI
Executed: 2014-06-19
NAKAMURA, TOMOJI
Executed: 2014-06-25
Assignee
FUJITSU SEMICONDUCTOR LIMITED
2-10-23 SHIN-YOKOHAMA, KOHOKU-KU, YOKOHAMA-SHI, KANAGAWA, 222-0033, JAPAN
Covered Property (1)
Semiconductor Device Having a Multilayer Interconnection Structure
Patent: 9,209,111 →
Application: 14/322,491 →
Publication: US 2014/0312507
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Conveying Party Data to Include Omitted Party Previously Recorded on Reel 033777 Frame 0356. Assignor(S) Hereby Confirms the Assignment of Assignors' Interest. Sep 26, 2014
From: WATANABE, KENICHI; NAKAMURA, TOMOJI; OTSUKA, SATOSHI
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 034095/0184 →
Change of Address Dec 23, 2016
From: FUJITSU SEMICONDUCTOR LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 041188/0401 →
Assignment of Assignor's Interest Jul 14, 2020
From: FUJITSU SEMICONDUCTOR LIMITED
To: AIZU FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 053209/0468 →
Change of Name and Change of Address Jul 16, 2020
From: AIZU FUJITSU SEMICONDUCTOR LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 053481/0962 →