Patent Assignment
Reel/Frame 033800/0341
Assignment of Assignor's Interest
Recorded: 2014-09-23
Pages: 2
Assignee
HITACHI METALS, LTD.
1-2-1, SHIBAURA, MINATO-KU,, TOKYO, 105-8614, JAPAN
Covered Property
(1)
Method for Preparing Low-Melting-Point Plating Solution for Aluminum Electroplating, Plating Solution for Aluminum Electroplating, Method for Producing Aluminum Foil, and Method for Lowering Melting Point of Plating Solution for Aluminum Electroplating
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.