Patent Assignment
Reel/Frame 033863/0470
Assignment of Assignor's Interest
Recorded: 2014-10-01
Pages: 4
Assignor
HONG, MIN GI
Executed: 2014-09-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same