Patent Assignment
Reel/Frame 033912/0324
Assignment of Assignor's Interest
Recorded: 2014-10-08
Pages: 5
Assignors
KANG, UN-BYOUNG
Executed: 2014-06-23
CHO, TAE-JE
Executed: 2014-06-23
ROH, BYUNG-HYUG
Executed: 2014-06-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Chip-Stacked Semiconductor Package and Method of Manufacturing the Same