Patent Assignment
Reel/Frame 033915/0014
Assignment of Assignor's Interest
Recorded: 2014-10-08
Pages: 2
Assignors
LII, MIRNG-JI
Executed: 2014-09-30
LEE, CHIEN-HSUN
Executed: 2014-09-30
LIANG, YU-MIN
Executed: 2014-09-30
WU, JIUN YI
Executed: 2014-09-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Pop Joint Through Interposer